Mems timing solutions
MEMS TIMING SOLUTIONS WINDOWS
These include lower power consumption by several orders of magnitude, range measurement accuracy that is not affected by ambient light conditions such as direct sunlight, the ability to sense any color object as well as windows and glass doors, a wide and customizable field of view (FoV), and 100 times lower range noise,” said Michelle Kiang, CEO, Chirp Microsystems, a TDK Group Company. “Our MEMS-based ultrasonic sensing technology offers multiple advantages over more traditional infrared proximity and ToF sensors. Application notes such as mechanical integration & handling/assembly guides.SmartSonic evaluation kit software, SonicLink, & documentation.
MEMS TIMING SOLUTIONS SOFTWARE
The CH-101 sensor module connects directly into the SmartSonic developer evaluation kit (DK-CH101) for initial product evaluation using the SonicLink™ software, which can also be used by customers to develop embedded algorithms for specific applications.Īvailable now through distribution partners, all the supporting software and documentation is available within the Developers Corner section of the TDK website, which includes: It is designed to allow rapid integration into customer product enclosures, prototyping and small-scale production for a wide range of applications, including AR/VR, smart home technology, drones and robotics, connected IoT devices, mobile and wearable technology, and automotive. The CH-101 ultrasonic ToF sensor module (MOD-CH101) contains a CH-101 sensor on a small printed circuit board (PCB) with flat flexible connector (FFC), and acoustic housing on top that enables an omnidirectional beam pattern of the output. The SmartSonic platform is currently available with the award-winning Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency. TDK Corporation (TSE:6762) today announced the immediate availability of the Chirp SmartSonic™ platform family of ultrasonic sensor time-of-flight (ToF) solutions. SmartSonic evaluation kit and sensor modules are currently available worldwide through Avnet, Components Distribution, Inc., DigiKey, Mouser Electronics and Symmetry.SmartSonic platform currently includes the award-winning Chirp CH-101 ultrasonic Time-of-Flight (ToF) sensor and sensor module, the SmartSonic evaluation kit and the associated SonicLink™ software.We work in close cooperation with our customers and leverage the cross functional expertise of Cohu’s product teams semiconductor ATE, test handler and interface solutions. Pre-validated Test Cells delivering fast ramp to production yield and throughputĬohu is the only company with the expertise on the entire test cell and inspection and is recognized for its industry-leading suite of flexible and cost-effective MEMS test cell offerings. Variety of Sensor Test Applications and Low Cost of TestĬohu MEMS modules are available for a variety of sensor test applications, for singulated devices in various input media and also the unique and cost-efficient strip test in carriers, allowing the highest test parallelism in the market, and thus reducing cost of test. This flexibility and modularity provides the best return on investment by being able to react fast to market changes and accelerating time-to-market. The modular design concept allows the greatest flexibility for our customers as it allows ease of conversion between stimulus types.
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Best Return on Investment Provided by Greatest Flexibility Cohu MEMS solutions combine the advantages of well-established and production-proven tri-temp test handling equipment with innovative concepts to meet the special requirements of the MEMS market.